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Chemicals for Electronics Component

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  • What is Chemicals for Electronics Parts
  • New Tin Plating Process
  • Post Treatment Chemical
  • Plating Process to Mitigate Outbreak of Whiskers
  • Our techinical skill

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New Tin Plating Process

Low carbon type bright Sn plating（METASU SNV-300 process）

Characteristics

  1. 1）Does not generate gathering after reflow(No drawing).
  2. 2）Decrease to tarnish after reflow.
  3. 3）Maintain excellent solder-wettability.
  4. 4）Since it is bright uniform, it has better scratch-preventing performance.

Comparison of Carbon deposition

Compared with bright Tin was used, METASU SNV-300 has much lower corbon deposition!!

Semi-conductor market Sn plating（METASU FSM series）

Characteristics

  1. 1）It is excellent process that is adopted in Semiconductor markets.
  2. 2）Able to gain uniform crystallization over wide range of current density.

Image of formed crystals under different current density

5ASD

10ASD

30ASD

Above are the SEM image of tin crystals after plated using 5 - 30 ASD As shown,
it is able to gain uniform crystallization from wide range of current density.

Product Retrieval & Download

Please check to Detailed information about METASU FSM series.

METASU FSM series

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