HOME > Our techinical skill > Chemicals for Electronics Component：Post Treatment Chemical

Chemicals for Electronics Component

ContentsList

  • What is Chemicals for Electronics Parts
  • New Tin Plating Process
  • Post Treatment Chemical
  • Plating Process to Mitigate Outbreak of Whiskers
  • Our techinical skill

Products FAQ

Inquiry

Product search

Post Treatment Chemical

Sealer for Au plating (HS-12)

Characteristics

  1. 1) It is water based chemical. It has higher corrosion resistance.
  2. 2) It is water linked filming unlike ordinary product.
    Not generate any uneven spot marks by hydrophilic.
  3. 3) Good defoaming property, easy to handle.
  4. 4) This process does not alter contact resistance.

Corrosion resistance

Contact resistance
METASU HS-12 process gave much higher corrosion resistance No change in contact resistance

Solder-wettaility protection process for Sn plating (METASU RB)

Characteristics

  1. 1) It is able to keep better solder-wettability, even caused by time driven change in Sn, Sn alloy plated film.
  2. 2) Does not generate stains and unevenness after treatment.
  3. 3) This process does not influences on Au, Ni.

Solder wettability

Mechanism
Decrease in solder-wettability was eliminated after PCT With immersion process, it will from Organic/Inorganic layer

Product Retrieval & Download

Please check to Detailed information about METASU FSM series.

METASU FSM series

Inquiry of Our Company

Please inquire details of the chemicals for Electronics Component to our company business member.

Contact us

Page top