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Chemicals for Electronics Component

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  • What is Chemicals for Electronics Parts
  • New Tin Plating Process
  • Post Treatment Chemical
  • Plating Process to Mitigate Outbreak of Whiskers
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Post Treatment Chemical

Sealer for Au plating (METASU HS-15P)

Characteristics

  1. 1) Excellnet corrosion resistance against corrosive environment.
  2. 2) No finding of increase in contact resistance and lowering solder wettability.
  3. 3) It is normal emulsion type, No occurrence of stain and uneven appearance.

Corrosion resistance

Contact resistance
Observed far better corrosion resistance against various conditions after sealer process. No charge in contact resistance after treated with METASU HS-15P.

Post Treatment Chemical

Solder-wettability protection process for Sn plating (METASU RB)

Characteristics

  1. 1) It is able to keep better solder-wettability, even caused by time driven change in Sn, Sn alloy plated film.
  2. 2) Does not generate stains and unevenness after treatment.
  3. 3) This process does not influences on Au, Ni.

Solder wettability

Mechanism
Decrease in solder-wettability was eliminated after PCT With immersion process, it will from Organic/Inorganic layer

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Please check to Detailed information about METASU HS series.

METASU HS series

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